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Number of results 262

UNE-EN 61249-2-44:2016  UNE

Status: In force / 2016-08-01

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 62326-1:2004  UNE

Status: In force / 2004-02-27

Printed boards -- Part 1: Generic specification

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61249-8-7:1997  UNE

Status: In force / 1997-10-17

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS. SECTION 7: MARKING LEGEND INKS.

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 16602-70-60:2019  UNE

Status: In force / 2019-08-01

Space product assurance - Qualification and Procurement of printed circuit boards (Endorsed by Asociación Española de Normalización in August of 2019.)

CTN 28 AEROSPACE MATERIAL

UNE-EN IEC 61188-6-4:2019  UNE

Status: In force / 2019-08-01

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (Endorsed by Asociación Española de Normalización in August of 2019.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN IEC 62496-4-1:2019  UNE

Status: In force / 2019-06-01

Optical circuit boards - Part 4-1: Interface standards - Terminated waveguide OCB assembly using single-row twelve-channel PMT connectors (Endorsed by Asociación Española de Normalización in June of 2019.)

CTN 212/SC 86 OPTICAL FIBRES

UNE-EN IEC 61191-1:2018  UNE

Status: In force / 2018-12-01

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by Asociación Española de Normalización in December of 2018.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN IEC 61189-2-630:2018  UNE

Status: In force / 2018-11-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (Endorsed by Asociación Española de Normalización in November of 2018.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN IEC 61249-2-45:2018  UNE

Status: In force / 2018-05-01

Materials for printed boards and other interconnecting structures – Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN IEC 61249-2-46:2018  UNE

Status: In force / 2018-05-01

Materials for printed boards and other interconnecting structures – Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN IEC 61249-2-47:2018  UNE

Status: In force / 2018-05-01

Materials for printed boards and other interconnecting structures – Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61191-4:2017  UNE

Status: In force / 2017-12-01

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2017.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 62496-2:2017  UNE

Status: In force / 2017-11-01

Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards (Endorsed by Asociación Española de Normalización in November of 2017.)

CTN 212/SC 86 OPTICAL FIBRES

UNE-EN 61191-2:2017  UNE

Status: In force / 2017-11-01

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61191-3:2017  UNE

Status: In force / 2017-10-01

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61189-5-503:2017  UNE

Status: In force / 2017-09-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (Endorsed by Asociación Española de Normalización in September of 2017.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61188-7:2017  UNE

Status: In force / 2017-08-01

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (Endorsed by Asociación Española de Normalización in August of 2017.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61189-5-1:2016  UNE

Status: In force / 2016-11-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (Endorsed by AENOR in November of 2016.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61189-2-719:2016  UNE

Status: In force / 2016-11-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (Endorsed by AENOR in November of 2016.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 16602-70-12:2016  UNE

Status: In force / 2016-11-01

Space product assurance - Design rules for printed circuit boards (Endorsed by AENOR in November of 2016.)

CTN 28 AEROSPACE MATERIAL

UNE-EN 61249-2-43:2016  UNE

Status: In force / 2016-08-01

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 62326-20:2016  UNE

Status: In force / 2016-06-01

Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (Endorsed by AENOR in June of 2016.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61189-3-719:2016  UNE

Status: In force / 2016-05-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (Endorsed by AENOR in May of 2016.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 62878-1-1:2015  UNE

Status: In force / 2015-08-01

Device embedded substrate - Part 1-1: Generic specification - Test methods (Endorsed by AENOR in August of 2015.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61189-2-721:2015  UNE

Status: In force / 2015-08-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (Endorsed by AENOR in August of 2015.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61189-5-4:2015  UNE

Status: In force / 2015-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (Endorsed by AENOR in April of 2015.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61189-5-3:2015  UNE

Status: In force / 2015-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (Endorsed by AENOR in April of 2015.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61189-5-2:2015  UNE

Status: In force / 2015-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (Endorsed by AENOR in April of 2015.)

CTN 203/SC 35 PRIMARY CELLS AND BATTERIES

UNE 21302-541:1992  UNE

Status: In force / 2015-01-23

ELECTROTECHNICAL VOCABULARY. PRINTED CIRCUITS.

CTN 191/SC 5 ELECTRICAL TERMINOLOGY

UNE-EN 60947-4-3:2014  UNE

Status: In force / 2014-10-15

Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads

CTN 201/SC 121AB APPARATUS AND ASSEMBLIES FOR LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR

UNE-EN 61249-4-18:2013  UNE

Status: In force / 2014-02-01

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in February of 2014.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61249-4-19:2013  UNE

Status: In force / 2014-02-01

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Hich performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in February of 2014.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 62496-2-4:2013  UNE

Status: In force / 2013-11-01

Optical circuit boards - Basic test and measurement procedures - Part 2-4: Optical transmission test for optical circuit boards without input/output fibres (Endorsed by AENOR in November of 2013.)

CTN 212/SC 86 OPTICAL FIBRES

UNE-EN 61191-2:2013  UNE

Status: In force / 2013-11-01

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by AENOR in November of 2013.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61191-1:2013  UNE

Status: In force / 2013-10-01

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by AENOR in October of 2013.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61189-11:2013  UNE

Status: In force / 2013-08-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (Endorsed by AENOR in August of 2013.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61249-2-39:2013  UNE

Status: In force / 2013-05-01

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in May of 2013.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61249-2-30:2013  UNE

Status: In force / 2013-05-01

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in May of 2013.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61249-2-27:2013  UNE

Status: In force / 2013-05-01

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in May of 2013.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61249-2-40:2013  UNE

Status: In force / 2013-05-01

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in May of 2013.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61182-2-2:2012  UNE

Status: In force / 2012-08-01

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description (Endorsed by AENOR in August of 2012.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 62496-2-1:2011  UNE

Status: In force / 2012-01-01

Optical circuit boards - Part 2-1: Measurements - Optical attenuation and isolation (Endorsed by AENOR in January of 2012.)

CTN 212/SC 86 OPTICAL FIBRES

UNE-EN 62496-2-2:2011  UNE

Status: In force / 2011-07-01

Optical circuit boards - Test and measurement procedures -- Part 2-2: Measurements: Dimensions of optical circuit boards (Endorsed by AENOR in July of 2011.)

CTN 212/SC 86 OPTICAL FIBRES

UNE-EN 62496-4:2011  UNE

Status: In force / 2011-07-01

Optical circuit boards - Interface standards - Part 4: General and guidance (Endorsed by AENOR in July of 2011.)

CTN 212/SC 86 OPTICAL FIBRES

UNE-EN 62496-3:2011  UNE

Status: In force / 2011-06-01

Optical circuit boards -- Part 3: Performance standards - General and guidance (Endorsed by AENOR in June of 2011.)

CTN 212/SC 86 OPTICAL FIBRES

UNE-EN 61249-2-41:2010  UNE

Status: In force / 2010-09-01

Materials for printed boards and other interconnecting structures -- Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in September of 2010.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61249-2-42:2010  UNE

Status: In force / 2010-09-01

Materials for printed boards and other interconnecting structures -- Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in September of 2010.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 61191-6:2010  UNE

Status: In force / 2010-08-01

Printed board assemblies -- Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (Endorsed by AENOR in August of 2010.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

UNE-EN 62496-3-1:2010  UNE

Status: In force / 2010-06-01

Optical circuit boards - Performance standard -- Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres (Endorsed by AENOR in June of 2010.)

CTN 212/SC 86 OPTICAL FIBRES

UNE-EN 61249-4-14:2009  UNE

Status: In force / 2009-12-01

Materials for printed boards and other interconnecting structures -- Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.)

CTN 203/SC 91-119 ELECTRONICS ASSEMBLY TECHNOLOGY AND PRINTED ELECTRONICS

Number of results 262